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Sensors Provide Early Diagnosis Of Microcracks In Aircraft |
 Today's aircraft are in service virtually around the clock and must operate reliably and safely at all times. An active sensor system helps to detect concealed fatigue cracks in aircraft bodies, thus reducing maintenance times considerably.
If a tiny crack in the hull of an aircraft remains undetected for a long time, it can easily spread and put passengers’ lives at risk. Each component is therefore subject to international maintenance regulations: Aircraft bodies must be thoroughly inspected every 15 to 18 months, depending on the type of plane. This often requires the technicians to dismantle an aircraft’s interior lining – an expensive and time-consuming process involving several days of downtime in the hangar. Researchers at the Fraunhofer Institute for Structural Durability and System Reliability LBF in Darmstadt are developing a sensor system that allows engineers to continuously monitor the condition of their aircraft and detect any damage at an early stage.
The system is based on piezoceramic sensors that are attached to the aircraft body in a network pattern. What is special about these sensors is that they start to oscillate when a voltage is applied to them – and when they are subjected to pressure, they generate voltage. The scientists make use of both effects: While the piezo foils cause part of the hull to oscillate, the others measure the component’s response to this stimulation. “We investigated the oscillation behavior of damaged struts and rivets in an aircraft body and compared it with that of intact parts,” explains LBF project manager Dirk Mayer. “If a component is defective, it oscillates at a different frequency from one that is intact when stimulated by the piezoceramics – just as a cracked glass sounds different from an undamaged one when you tap it with your fingernail.” In this way, the researchers can accurately track down faults and monitor their development – be it fatigue cracks in the hull and wings, or rivets and other joining parts coming loose. This form of observation is also referred to as ‘structural health monitoring’ (SHM).
“With the help of this system, any damage behind the lining or in difficult-to-reach places can be identified quickly and easily, thus reducing maintenance times and inspection costs,” says Mayer. The researchers have already performed tests on a hull component in the laboratory, and are now implementing the new technology with standardized piezo and electronic components. The system will then also be suitable for use in vehicle manufacture or engine and plant construction.
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Dear Editor,
I hope you can help me or at least point me in the right direction. My neighbor just put up a huge CB Radio antennea, the thing is higher that the roof of his home, the problem is, now I have interference through our television set speakers. We can hear him speaking although it is not too clear. How can I fix the problem so that we can watch t.v. without hearing this noise? Any help you can give me would be greatly appreciated.
Sincerly,
Donna R.
Dear Donna,
If your neighbor's transmissions are interfering with your TV, the best thing for you to do is complain to the Federal Communications Commission. The FCC investigates cases of interference and they will determine if your neighbor's transmissions contain out-of-band signals. You might also try talking to your neighbor. If his antenna is for amateur radio rather than Citizens Band, "ham" radio operators have a policy of supplying a free filter for your TV in such cases.
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ElectronicDesignNet News
Intersil's USB 2.0 Multiplexer Reduces Connectors And Improves Cradle Functionality |
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Product Showcase - Friday
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Wednesday, 09 May 2007 |
Intersil introduced the ISL54200 USB 2.0 high/full speed multiplexer. With a wider supply voltage range, higher bandwidth and better insertion loss characteristics than the competition, this device provides the most flexible IC for interfacing USB and non-USB portable devices. The flexibility of the ISL54200 comes from its ability to switch between data sources having different data speeds and signal levels, and to output them through a common connector. When used inside a portable device such as cellphone it alternately allows chips with high-speed (480Mbps) USB circuitry and chips with lower speed UART or Full Speed (12Mbps) USB to communicate through a single connector. In automotive applications where portable products are often placed in a cradle, a common cradle connector can serve multiple portable products with differing data signaling interface requirements while retaining a common USB cable connection to the automobile electronics. And, when used in a laptop docking station it allows a single USB Host connection to provide two data ports serving external devices having High Speed or Full Speed USB signaling capability....more  (0) Comments |
NEC, JST, And RIKEN Successfully Demonstrate World's First Controllably Coupled Qubits |
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Components / Sensors - Thursday
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Wednesday, 09 May 2007 |
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NEC, Japan Science and Technology Agency (JST) and the Institute of Physical and Chemical Research (RIKEN) have together successfully demonstrated the world's first quantum bit (qubit) circuit that can control the strength of coupling between qubits. Technology achieving control of the coupling strength between qubits is vital to the realization of a practical quantum computer, and has been long awaited in the scientific field. The quantum computer, when it is finally brought to fruition, is expected to far surpass the capabilities of even the most modern of today's supercomputers. Actual computing in a quantum computer is carried out by manipulating the quantum state of qubits in time sequence by external controls. To achieve such manipulation, it is necessary to control the: 1. States of individual qubits, 2. States of two qubits (logic operation), and 3. Ability to turn on /off the coupling between qubits....more (0) Comments |
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Intel And Micron Sampling Multi-Level Cell NAND Flash Memory |
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Product Showcase - Friday
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Wednesday, 09 May 2007 |
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Intel and Micron Technology announced they are sampling 50 nanometer (nm) multi-level cell (MLC) NAND flash memory manufactured by their NAND flash memory joint venture, IM Flash Technologies. The MLC NAND flash memory components feature a die and cell size suited for use in today's computing and consumer electronics devices that are increasingly smaller and more efficient themselves. The 50nm MLC technology, sampling at a 16 gigabit (Gb) die density, complements the previously announced 50nm single-level cell (SLC) products that the companies are shipping today at a 4 Gb die density....more (0) Comments |
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