High-Performance 8-Bit MCUs Can Carry Both TCP/IP And Application Load |
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Friday, 11 May 2007 |
In today’s networked world users expect to manage all devices with their standard tools and to communicate using TCP/IP. For many designs this requires an upgrade from RS-232/RS-485 to Ethernet 10/100, and it might also involve protocol-conversion, going from a proprietary protocol to SNMP (Simple Network Management Protocol). Some examples for this trend are uninterruptible power supplies, telecom power supplies, and industrial control systems. With a network interface these devices can be remotely monitored/configured so status information is available in real time....more  (0) Comments |
Power Components: ICs Address Alternative Energy Sources |
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Wednesday, 09 May 2007 |
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Imagine a cell phone that offers endless standby power, or an MP3 player that never needs recharging. That is the promise of powering portable consumer electronics devices off renewable power sources. By harvesting power from external sources such as solar or micro fuel cells, systems can tap into what is for all practical purposes an infinite source of energy. But designers building systems capable of drawing power from such sources face daunting obstacles. First, power circuits tapping the sources must support input voltages as low as 0.3 volt. "A single solar cell usually operates between 0.4 and 0.7 V with no load. If you add a load to the output and pull out a couple of milliamps of current, your voltage drops down to between 0.5 V and 0.4 V or a little below," said Alex Friebe, product-marketing engineer for dc/dc converters at Texas Instruments....more (0) Comments |
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NEC, JST, And RIKEN Successfully Demonstrate World's First Controllably Coupled Qubits |
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Wednesday, 09 May 2007 |
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NEC, Japan Science and Technology Agency (JST) and the Institute of Physical and Chemical Research (RIKEN) have together successfully demonstrated the world's first quantum bit (qubit) circuit that can control the strength of coupling between qubits. Technology achieving control of the coupling strength between qubits is vital to the realization of a practical quantum computer, and has been long awaited in the scientific field. The quantum computer, when it is finally brought to fruition, is expected to far surpass the capabilities of even the most modern of today's supercomputers. Actual computing in a quantum computer is carried out by manipulating the quantum state of qubits in time sequence by external controls. To achieve such manipulation, it is necessary to control the: 1. States of individual qubits, 2. States of two qubits (logic operation), and 3. Ability to turn on /off the coupling between qubits....more (0) Comments |
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Hynix Announces Industry's First DDR3 Memory Validations |
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Wednesday, 09 May 2007 |
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Hynix Semiconductor announced it has received the industry’s first validation on its DDR3 memory components and modules from Intel. Hynix’s newly-validated DDR3 products are 1Gigabit DDR3 SDRAM component manufactured on the Company’s leading edge 80nm process technology, 1Gigabyte and 2Gigabyte DDR3 Unbuffered-DIMMs. These devices boast operating speeds of 800MHz and 1066MHz at 1.5V power supply - the fastest in the industry. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for 800MHz, and 7-7-7 for 1066MHz, to suit the needs of a wide range of PCs, workstations and other applications....more (0) Comments |
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Vertical Circuits Stacks And Interconnects Dies |
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Wednesday, 09 May 2007 |
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Vertical Circuits announced the release of its near through silicon via (TSV) die stacking technology for high volume, low cost applications. Designed and optimized to address chip scale vertical integration applications, Vertical Circuits’ patented VIP (Vertical Interconnect Pillar) process consists of the application of a thin dielectric coating to the semiconductor device to be stacked, while still in wafer form, and a vertical interconnection to the sides of the die stack. Unlike TSV based processes, there are no changes required in the fundamental die design or layout. Vertical Circuits’ VIP technology enables the stacking of multiple same size devices for high density memory applications as well as mixed size devices, from multiple vendors, for chip scale SiP (System in Package) designs....more (0) Comments |
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IBM Brings Nature To Nanoscale IC Manufacturing |
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Tuesday, 08 May 2007 |
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First-ever manufacturing application of "self assembly" used to create a vacuum -- the ultimate insulator -- around nanowires for next-generation microprocessors. IBM announced the first-ever application of a self-assembling nanotechnology to conventional chip manufacturing, borrowing a process from nature to build the next generation computer chips. The natural pattern-creating process that forms seashells, snowflakes, and enamel on teeth has been harnessed by IBM to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip. In chips running in IBM labs using the technique, the researchers have proven that the electrical signals on the chips can flow 35 percent faster, or the chips can consume 15 percent less energy compared to the most advanced chips using conventional techniques....more (0) Comments |
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